COMIC CLASSROOM
Visual classrooms that turn dense engineering topics into ideas you can remember and use.
Begin with why people hack consoles, then examine PS4, Xbox 360, PS3, 3DS, and Switch security cases before connecting threat models to Secure Boot, TEE, and SoC memory isolation.
A readable history of console media checks, region rules, interoperability, and the different ways attackers crossed trust boundaries—from TMSS to PS1 discs and PS2 software flaws.
Follow update authorization, target compatibility, anti-rollback, interruption-safe installation, trial boot, signing-key rotation, and recovery—and learn what each safeguard cannot guarantee.
Starting with a factory gateway that asks to connect, this classroom explains how Secure Boot, Measured Boot, and Remote Attestation work together—and what a successful check cannot prove.
Start with photo conversion to separate individual latency, batch speedup and service throughput. Worked examples explain parallel work, Amdahl, shared bottlenecks and cost, followed by the limits of AI workflows, RISC-V claims and demand rebound.
Follow a research SoC incident through DEKs, KEKs, HUKs, authorization, rotation, revocation, recovery and cryptographic erasure. Twelve comics, a full lesson, engineering extensions and 26 runnable teaching-model tests.
Twelve comics follow a lab report across a hostile network, connecting TLS 1.3 keys, certificates, Finished and AEAD to authorization, forward secrecy and replay boundaries.
Twelve illustrated lessons start with one unfamiliar public key, open an X.509 certificate, follow its chain to a trust anchor, and finish with lifecycle, revocation, and device PKI.
Follow a repair notice through copied seals, hashes, signing, verification, and public-key trust. Twelve comics explain what a signature proves—and what still needs checking.
Twelve comics begin with the attacker's goal, then build Secure Boot from reset, a protected trust anchor, hashes, signatures, version policy, failure handling, and authenticated recovery.
Follow ECC from its 1985 origin through elliptic curves, point addition, Galois fields, scalar multiplication, and the simple idea that a private key is a number while a public key is a point.
Twelve illustrated lessons move from an exposed house key to HUK, key storage, trusted boot, secure storage, internal and external trust, and the complete hardware root-of-trust boundary.
Twelve illustrated lessons explain data movement, reticle stitching, defect tolerance, local SRAM, dataflow, CSoft, CS-4, prefill and decode, and the trade-offs among Cerebras, GPU clusters, and hardwired inference.
Start with Alice's first-key problem, build an intuitive picture of primes and modular cycles, work through RSA's complete 7→13→7 example, then return to public-key identity and key exchange.
Follow data stalls and conflicting cached copies to understand cache, MESI, snoops, and directories, then examine false sharing, memory ordering, and CXL's limits.
A ten-plate classroom on hardwired inference: why moving weights is expensive, how a 4-bit lookup-and-select teaching model works, and how to read HC1's public numbers without overclaiming.
Eight illustrated lessons separate RSA factorization, the elliptic-curve discrete logarithm, Shor's period clues, and the post-quantum migration work that matters today.
Ten illustrated lessons explain SHA digests, resistance properties, the birthday bound, SHA-1's retirement, and the role of hashing in software and hardware security.
A 12-page visual guide to credentials, authentication, authorization, passwords, keys, certificates, tokens, device identity, attestation, and PUF. Start with a simple door-check story, then connect each picture to practical security design.
A six-page classroom that starts with a simple question: how does an LLM keep writing one piece at a time? We begin with next-token prediction, then move into tokens, vectors, K/V notes, KV Cache, and the memory cost that appears when conversations get long.
A nine-page classroom that turns the EU Cyber Resilience Act into a product-readiness map: scope, reporting dates, product classes, Annex I duties, conformity assessment, CE marking, and the evidence a real team must keep.
Two CPUs both say 3GHz. Why does one finish the same job sooner? Follow a factory's work orders to understand IPC, branch prediction, out-of-order execution, and memory waits, then learn what a specification sheet leaves out.
A ten-page classroom on why toner cartridge security is really a supply-chain trust problem. It starts with attacker incentives and PKI authentication, then explains why private keys, counters, and cartridge state need PUF and Secure Storage protection.
A six-page classroom on the hidden bottleneck in AI inference: not enough data arriving at the compute units. It connects GPU, HBM, ASIC, CXL, DRAM, and near-memory compute as different ways to keep inference hardware fed.
An eight-page classroom on FIPS 140-3 as a security inspection for cryptographic modules. It explains the validation flow, the assurance levels, and the hardware questions around keys, tamper response, roles, and evidence.
A six-page classroom on the base die at the bottom of an HBM stack. It explains why the base die is more than wiring, how traditional DRAM repair changes in a 3D stack, and why repair can protect the value of the whole AI package.
A five-page classroom on why GPUs need HBM. It starts with a simple road-width problem, then explains GDDR limits, silicon interposers, TSV stacks, HBM3E, HBM4, and why bandwidth gains bring packaging and yield challenges.
Thirteen illustrated lessons follow a SoC data key through PUF physics, noisy reconstruction, NeoPUF formation and readout, key wrapping, HUK derivation and system recovery.
A five-page classroom that explains AES as a repeated encryption workshop: fixed-size data blocks move through substitution, shifting, mixing, and key addition until the plaintext becomes hard to reverse without the key.
A seven-page classroom on advanced packaging as the work of moving chips closer together. It compares CoWoS, silicon interposers, CoPoS, ABF substrates, and PCBs by the distance, density, bandwidth, and yield problems they solve.
